| Number | Title | Author | Affiliation | |
| 3-03 [6607-11] |
Alternating Phase-Shift Mask and Binary Mask for 45-nm Node and Beyond:The Impact on the Mask Error Control |
Y.Kojima(1), M.Shirasaki(1), K.Chiba(1), T.Tanaka(1), K.Iwase(2), K.Ishikawa(2), K.Ozawa(2), Y.Inazuki(3), H.Yoshikawa(3), S.Okazaki(3) | (1)Toppan Printing Co., Ltd. (Japan) (2)Sony Corp. (Japan) (3)Shin-Etsu Chemical Co., Ltd. (Japan) |
Best Paper for BACUS |
| 8-02 [6607-34] |
Novel solution for in-die phase control under scanner equivalent optical settings for 45nm node and below | S.Perlitz(1), U.Buttgereit(1), T.Scheruebl(1), K.m.Lee(2), M.Tavassoli(2), M.Lau(2) | (1)Carl Zeiss SMS GmbH(Germany) (2)Intel Mask Operation(USA) |
|
| 13-01 [6607-56] |
Impact of Scanner Model Vectorization On Optical Proximity Correction | J.K.Tyminski(1), T.Nakashima(2), Q.Zhang(3), T.Matsuyama(2), K.Lucas(4) | (1)Nikon Precision Inc.(USA) (2)Nikon Corporation(Japan) (3)Synopsys Inc.(CA USA) (4)Synopsys Inc.(TX USA) |
| Number | Title | Author | Affiliation | |
| 5f-03 [6607-85] |
Impact of Transmitted & Reflected Light Inspection on Mask Inspectability, Defect Sensitivity and Mask Design Rule Restrictions | Y.Kodera(a), K.Badger(b), E.Gallagher(b), S.Akima(d), M.Lawliss(b), H.Ikeda(a), I.Stobert(c), Y.Kikuchi(a) | (a)Toppan Electronics Inc. (USA) (b)IBM Systems and Technology Group (VT USA) (c)IBM Systems and Technology Group (NY USA) (d)Toppan Printing Co., Ltd. (Japan) |
|
| 5k-02 [6607-109] |
New OPC method for contact layer to expand process margin | M.Oka, R.Tsutsui, H.Oishi, K.Tsuchiya, H.Ohnuma | Sony Corp. (Japan) | |
| 5m-08 [6607-124] |
Progress of NIL template making | S.Yusa, T.Hiraka, A.Kobiki, S.Sasaki, K.Itoh, N.Toyama, M.Kurihara, H.Mohri, N.Hayashi | Dai Nippon Printing Co., Ltd. (Japan) | Best Paper for EMLC |