Committees

Advisory Committee
ChairYasuoTaruiTokyo University of Agri.&Tech.Japan
MasanoriKomuroNew Energy and Industrial Technology Development OrganizationJapan
MasatoshiMigitakaToyota Technological Institute Japan
MasaoOtakiToppan Printing Co., Ltd.Japan
NorioSaitoNippon Institute of TechnologyJapan
YoshioTanakaLuminescent Technologies, Inc.Japan
Organizing Committee
ChairToshiyukiHoriuchiTokyo Denki UniversityJapan
Vice ChairMasatoShibuyaTokyo Polytechnic UniversityJapan
UweBehringerUBC MicroelectronicsGermany
HankuChoSamsung Electronics Co.,LtdKorea
JunkoCollinsSEMI JapanJapan
Brian J.GrenonGrenon Consulting, Inc.USA
HideakiHamadaHTL Co. Japan Ltd.Japan
NaoyaHayashiDAI NIPPON PRINTING Co., Ltd.Japan
MorihisaHogaDai Nippon Printing Co., Ltd.Japan
EiichiHoshinoNIKON CORPORATIONJapan
GregoryHughesSEMATECHUSA
HiroichiKawahiraSony CorporationJapan
KokoroKatoSII NanoTechnology Inc.Japan
YuichiMatsuzawaToppan Printing Co., Ltd.Japan
HideakiMitsuiHOYA CORPORATIONJapan
WarrenMontgomeryCNSEUSA
IchiroMoriEUVL Infrustructure Development Center, Inc.Japan
ChenParksonTaiwan Mask CorporationTaiwan
YoshikiSuzukiKLA-Tencor Japan Ltd.Japan
TadahiroTakigawaASML Japan Co.,Ltd.Japan
KoichiroTsujitaCanon Inc.Japan
WataruWakamiyaJEOL Ltd.Japan
AntoYasakaSII NanoTechnology Inc.Japan
NobuyukiYoshiokaRenesas Electronics CorporationJapan
Steering Committee
ChairMorihisaHogaDai Nippon Printing Co., Ltd.Japan
Vice ChairKunihiroHosonoRenesas Electronics CorporationJapan
Vice ChairHiroaki MorimotoToppan Printing Co., Ltd.Japan
TakayukiAbeNuFlare Technology Inc.Japan
ShinjiAkimaToppan Printing Co., Ltd.Japan
NaoyaHayashiDAI NIPPON PRINTING Co., Ltd.Japan
NaoyukiIshiwataFUJITSU SEMICONDUCTOR LIMITEDJapan
KazukoJochiKLA-Tencor Japan Ltd.Japan
IchiroKagamiSony CorporationJapan
TakashiKamoToshiba Corporation Corporate Research & Development CenterJapan
KokoroKatoSII NanoTechnology Inc.Japan
HiroshiMohriDAI NIPPON PRINTING Co.,LTD.Japan
MasatoshiOdaNTT Advanced Technology CorporationJapan
YasushiOhkuboHOYA CorporationJapan
HiroyukiShigemuraRenesas Electronics CorporationJapan
ToshiyukiTakahashiJEOL Ltd.Japan
KiwamuTakehisaLasertec CorporationJapan
HiroyoshiTanabeIntel K.K.Japan
HidehiroWatanabeEUVL Infrustructure Development Center, Inc.Japan
Program Committee
ChairKokoroKatoSII NanoTechnology Inc.Japan
Vice ChairShinjiAkimaToppan Printing Co., Ltd.Japan
Vice ChairIchiroKagamiSony CorporationJapan
Vice ChairHiroshiMohriDAI NIPPON PRINTING Co.,LTD.Japan
AkihikoAndoRenesas Electronics CorporationJapan
TadashiAraiCanon Inc.Japan
JeffFarnsworthIntel Corporation Technology & Manufacturing GroupUSA
Thomas B.FaureIBM CorporationUSA
KazuyukiHagiwaraD2S, Inc.Japan
ShigeruHirukawaNikon Corp.Japan
KojiHosonoFUJITSU SEMICONDUCTOR LIMITEDJapan
GreggInderheesKLA-Tencor Corp.USA
Curt A.JacksonTOPPAN PHOTOMASKS, INC.USA
Byung-GookKimSAMSUNG ELECTRONICS.Korea
JunKotaniToppan Printing Co., Ltd.Japan
KoichiKuharaHOYA CORPORATIONJapan
JohnLinTaiwan Semiconductor Manufacturing CompanyTaiwan
MarkMaPhotronics, Inc.USA
KojiMuranoTOSHIBA CorporationJapan
YoshinoriNagaokaKLA-Tencor Japan Ltd.Japan
YasutoshiNakagawaJEOL Ltd.Japan
NoriakiNakayamadaNuFlare Technology Inc.Japan
YujiNonamiPanasonic CorporationJapan
SteffenSchulzeMentor Graphics CorporationUSA
YasunariSohdaHitachi, Ltd.Japan
OsamuSugaEUVL Infrastructure Development Center, Inc.Japan
YojiTakagiAPPLIED MATERIALS Japan, Inc.Japan
KiwamuTakehisaLasertec CorporationJapan
HironobuTaokaRenesas Electronics CorporationJapan
TatsuyaTomitaDai Nippon Printing Co., Ltd.Japan
RichardTsengTaiwan Mask CorporationTaiwan
YoichiUsuiHOYA Corp.Japan