Committees

Advisory Committee
ChairYasuoTaruiTokyo University of Agri.&Tech.Japan
MorihisaHogaDai Nippon Printing Co., Ltd.Japan
MasanoriKomuroHIGH ENERGY ACCELERATOR RESEARCH ORGANIZATIONJapan
MasaoOtakiToppan Printing Co., Ltd.Japan
NorioSaitoNippon Institute of TechnologyJapan
YoshioTanakaLuminescent Technologies, Inc.Japan
Organizing Committee
ChairToshiyukiHoriuchiTokyo Denki UniversityJapan
Vice ChairMasatoShibuyaTokyo Polytechnic UniversityJapan
UweBehringerUBC MicroelectronicsGermany
ParksonChenTaiwan Mask CorporationTaiwan
Han-kuChoSamsung Electronics Co.,LtdKorea
JunkoCollinsSEMI JapanJapan
Brian J.GrenonAdvanced Technical InstrumentsUSA
TakehikoGunjiSony CorporationJapan
HideakiHamadaHTL Co. Japan Ltd.Japan
NaoyaHayashiDAI NIPPON PRINTING Co., Ltd.Japan
EiichiHoshinoNIKON CORPORATIONJapan
KunihiroHosonoRenesas Electronics CorporationJapan
GregoryHughesSEMATECHUSA
KokoroKatoHitachi High-Tech Science CorporationJapan
HideakiMitsuiHOYA CORPORATIONJapan
WarrenMontgomeryCNSEUSA
IchiroMoriEUVL Infrustructure Development Center, Inc.Japan
HiroakiMorimotoToppan Printing Co., Ltd.Japan
YoshikiSuzukiKLA-Tencor Japan Ltd.Japan
TadahiroTakigawaASML Japan Co.,Ltd.Japan
YojiTonookaToppan Printing Co., Ltd.Japan
KoichiroTsujitaCanon Inc.Japan
AntoYasakaHitachi High-Tech Science CorporationJapan
Steering Committee
ChairHiroakiMorimotoToppan Printing Co., Ltd.Japan
Vice ChairKunihiroHosonoRenesas Electronics CorporationJapan
Vice ChairHidehiroWatanabeEUVL Infrustructure Development Center, Inc.Japan
TakayukiAbeNuFlare Technology Inc.Japan
ShinjiAkimaToppan Printing Co., Ltd.Japan
KazukoJochiKLA-Tencor Japan Ltd.Japan
IchiroKagamiSony CorporationJapan
TakashiKamoToshiba Corporation Corporate Research & Development CenterJapan
KokoroKatoHitachi High-Tech Science CorporationJapan
YasutakaMorikawaDAI NIPPON PRINTING Co.,LTD.Japan
YasushiOhkuboHOYA CorporationJapan
TomoyukiOkadaFUJITSU SEMICONDUCTOR LIMITEDJapan
ToshiyukiTakahashiJEOL Ltd.Japan
KiwamuTakehisaLasertec CorporationJapan
HiroyoshiTanabeIntel K.K.Japan
Program Committee
ChairKokoroKatoHitachi High-Tech Science CorporationJapan
Vice ChairShinjiAkimaToppan Printing Co., Ltd.Japan
Vice ChairIchiroKagamiSony Semiconductor CorporationJapan
TsukasaAbeDai Nippon Printing Co.,Ltd.Japan
AkihikoAndoRenesas Electronics CorporationJapan
TadashiAraiCanon Inc.Japan
JeffFarnsworthIntel Corporation Technology & Manufacturing GroupUSA
Thomas B.FaureIBM CorporationUSA
KazuyukiHagiwaraD2S, K.K.Japan
ShigeruHirukawaNikon Corp.Japan
KojiHosonoFUJITSU SEMICONDUCTOR LIMITEDJapan
HidemichiImaiDAI NIPPON PRINTING Co.,LTD.Japan
GreggInderheesKLA-Tencor Corp.USA
FranklinKalkTOPPAN PHOTOMASKS, INC.USA
Byung-GookKimSAMSUNG ELECTRONICS.Korea
JunKotaniToppan Printing Co., Ltd.Japan
JohnLinTaiwan Semiconductor Manufacturing CompanyTaiwan
MarkMaPhotronics, Inc.USA
KojiMuranoTOSHIBA CorporationJapan
YoshinoriNagaokaKLA-Tencor Japan Ltd.Japan
YasutoshiNakagawaJEOL Ltd.Japan
NoriakiNakayamadaNuFlare Technology Inc.Japan
NaokiNishidaHOYA Corp.Japan
YujiNonamiPanasonic CorporationJapan
SteffenSchulzeMentor Graphics CorporationUSA
YasunariSohdaHitachi, Ltd.Japan
OsamuSugaEUVL Infrastructure Development Center, Inc.Japan
YojiTakagiAPPLIED MATERIALS Japan, Inc.Japan
KiwamuTakehisaLasertec CorporationJapan
HironobuTaokaRenesas Electronics CorporationJapan
RichardTsengTaiwan Mask CorporationTaiwan
YoichiUsuiHOYA Corp.Japan